Growth Characterization of Intermetallic Compound at the Ti/Al Solid State Interface
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چکیده
منابع مشابه
Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
The growth behavior of intermetallic compounds (IMCs) at the liquid-solid interfaces in Cu/Sn/Cu interconnects during reflow at 250 °C and 280 °C on a hot plate was investigated. Being different from the symmetrical growth during isothermal aging, the interfacial IMCs showed clearly asymmetrical growth during reflow, i.e., the growth of Cu6Sn5 IMC at the cold end was significantly enhanced whil...
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ژورنال
عنوان ژورنال: Materials
سال: 2019
ISSN: 1996-1944
DOI: 10.3390/ma12030472